Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

As a Qualcomm Hardware Engineering Intern, you'll apply your electrical and/or computer engineering studies on teams spanning system architecture, modeling, power and thermal; front-end design and RTL; synthesis and timing; design-for-test; physical design; pre-silicon verification; emulation; post-silicon validation; CAD; and GPU design. Tracks include GPU Engineering, CPU Engineering, Digital Design / DV and SoC Systems Engineering — indicate your interest on your resume. Requires enrollment in a bachelor's, master's or Ph.D. program in computer engineering, computer science, electrical engineering or a related field.

Qualcomm interns join world-class teams for 11–14 weeks during Summer 2027 (May–September). Requirements common to the program: currently enrolled in a degree program, with an expected graduation date of November 2027 or later (preferred: November 2027 – June 2028).

Pay: $17.00–$98.00 per hour (Qualcomm's broad pay scale for this intern job code at the posted location).