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As a Qualcomm Mechanical Engineering Intern, you'll design, simulate and test mechanical and thermal systems that support Qualcomm's advanced semiconductor technologies, with projects spanning IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling. Requirements: enrolled in a bachelor's, master's or Ph.D. program in mechanical engineering, materials science or a related field; 1+ years of academic experience with Python or MATLAB. Qualcomm interns join world-class teams for 11–14 weeks during Summer 2027 (May–September). Requirements common to the program: currently enrolled in a degree program, with an expected graduation date of November 2027 or later (preferred: November 2027 – June 2028). Pay: $17.00–$98.00 per hour (Qualcomm's broad pay scale for this intern job code at the posted location).