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Nokia
Co-op Program
 
Silicon Photonics Packaging Engineer Co-op
Nokia New York, NY
Education Recommendations  Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.  Your responsibilities We are searching for a Silicon Photonics Packaging Co-op for our Fall 2026 Term to engage in the research and development of silicon photonics transceiver modules.   Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers. Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met. Own Design Rules documents and ensure Design for Manufacturing specifications are met. Perform mechanical integrity and thermal simulations, tolerance analyses and characterization. Drive package debug activities during product validation and...

Jun 19, 2026
Nokia
Co-op Program
 
Mechanical Packaging Engineer Co-op
Nokia New York, NY
EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US.   Your responsibilities Perform mechanical integrity and thermal simulations, tolerance analyses and characterization. Support advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings. Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements. Drive package debug activities during product validation and qualification.   Your skills and experience Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software. Experience with thermal and thermo-mechanical simulations using ANSYS or similar software....

Jun 19, 2026
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